Shock Mitigation for Electronic Boards Within a Projectile

Shock Mitigation for Electronic Boards Within a Projectile

D. S. Somasundaram M. B. Trabia B. O'Toole Q. Liu

Department of Mechanical Engineering, University of Nevada, Las Vegas, Las Vegas, Nevada, USA

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Electronic components, which are widely used in modern projectiles, are subjected to high acceleration during launch. These accelerations may result in failure of the components, which affects the performance of the projectile. The objective of this research is to better understand how shocks are transmitted to electronic boards within a projectile and also to investigate ways of mitigating these shocks. To achieve these goals, a projectile prototype, composed of threaded components, was created. The effect of the tightening preload torque on the accelerations and the frequencies of the components on an electronic board were explored. An approach to mitigate transmitted accelerations to the board using a polyurethane rubber mount is presented. Suggestions for ensuring an accurate finite element model of the experimental setup are included.


Bolted joints, finite element analysis, impact analysis, projectile electronics, shock mitigation


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