Detection of process microdefects, within the warning limits of a control chart: Application to the wafer manufacturing in the semiconductor industry

Detection of process microdefects, within the warning limits of a control chart: Application to the wafer manufacturing in the semiconductor industry

Ikram Doumani Patrick Pujo Nacer M’Sirdi

IC STAR, Aix-Marseille Université, Technopole de Château Gombert, 60 rue Joliot Curie, F-13013 Marseille

CRET-LOG, Aix-Marseille Université, Av. Esc. Normandie Niémen, 13397 Marseille cedex 20

LSIS, Aix-Marseille Université, Av. Esc. Normandie Niémen, 13397 Marseille cedex 20

Corresponding Author Email: 
ikram.doumani@univ-amu.fr, patrick.pujo@univ-amu.fr, nacer.msirdi@univ-amu.fr
Page: 
161-180
|
DOI: 
https://doi.org/10.3166/JESA.49.161-180
Received: 
13 May 2015
|
Accepted: 
14 October 2015
|
Published: 
30 April 2016
| Citation
Abstract: 

A detection method of abrupt variations and changes in the evolution of a greatness in a process is presented. For that, at first the complexity of production processes in the semiconductor industry and the resulting difficulties in terms of quality control are described. The proposed detection method is used to observe changes in intrinsic variables of a product being produced or of a process. These changes could not be observed by classical control charts. This automatic method, inspired from signal processing, allows to model, estimate and predict the state of the process. It also allows to develop a break detection model based on hypothesis tests. These latter use the predicted state and the current state of the process to conclude on the presence of a variation corresponding to the detection of an event. This detection may motivate a decision making or prevent a dysfunction in the process.

Keywords: 

detection, abrupt change, prediction, ARMA, hypothesis tests

1. Introduction
2. Contexte et problématique
3. Méthodes de détection
4. Modélisation du mécanisme de détection
5. Simulations et résultats
6. Conclusion
Remerciements
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