Enhanced heat transfer by thermosyphon method in electronic devices

Enhanced heat transfer by thermosyphon method in electronic devices

K. Gopi Kannan R. Kamatchi  T. Venkatajalapathi  A.S. Krishnan 

School of Mechanical Engineering, Vellore Institute of Technology, Vellore 632 014, India

Department of Mechanical Engineering, SNS College of Technology, Coimbatore 641 049, India

Department of Mechanical Engineering, Coimbatore Institute of Technology, Coimbatore 641 014, India

Corresponding Author Email: 
17 July 2017
29 January 2018
31 March 2018
| Citation



In the present work, the heat dissipation rate and thermal resistance of electronic cooling system is investigated with different coolants by two-phase closed loop thermosyphon method for both steady and unsteady state conditions. The coolants used in this study are acetone, alcohol and petrol respectively and are poured in the created test facility. A square heater of size 35 × 35 mm is fixed in the primary tank and used as a heat source. The heat input is given to the system varies from 10 to 60 W. The temperature of the experimental setup is measured by seven K-type thermocouples which are attached at various locations. Results indicate that (i) the convective heat transfer coefficient increases and thermal resistance decreases with increasing of heat input for all the coolants (ii) the acetone has high heat removal rate of 65.4 % at 60 W due to low boiling point, high latent heat of evaporation and less effect on subcooling, which directly helps in phase change process and heat extraction rate (iii) a maximum reduction in thermal resistance of about 0.523 0C/W for acetone in comparison with alcohol and petrol by virtue of its high superheat which accelerates to nucleate boiling.


electronic cooling, closed loop thermosyphon, latent heat of evaporation, thermal resistance

1. Introduction
2. Experimental Setup
3. Result and Discussion
4. Conclusion

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