Growth of Copper Telluride Thin Films using Electrodeposition

Growth of Copper Telluride Thin Films using Electrodeposition

P. Jeyakumar S. Thanikaikarasan* B. Natarajan T. Mahalingam Luis Ixtlilco

Post Graduate and Research Department of Physics, Raja Dorai Singam Government Arts College,Sivagangai - 630 561, Tamil Nadu, India

Centre for Scientific and Applied Research, School of Basic Engineering and Sciences, PSN College of Engineering and Technology, Tirunelveli – 627 152,Tamil Nadu, India

Department of Physics, Alagappa University, Karaikudi – 630 004, Tamil Nadu, India

Universidad Politecnica del Estado de Guerrero, Taxco, Guerrero, Mexico

Corresponding Author Email: 
s_thanikai@rediffmail.com
Page: 
15-19
|
DOI: 
https://doi.org/10.14447/jnmes.v21i1.516
Received: 
6 October 2017
| |
Accepted: 
20 January 2017
| | Citation
Abstract: 

Copper Telluride thin films have been prepared on Fluorine doped Tin Oxide coated conducting glass substrates using electro-deposition technique. Cyclic voltammetric analysis has been carried out to analyze the growth mechanism of the deposited films. Thickness value of the deposited films has been estimated using Stylus profilometry. X-ray diffraction pattern revealed that the prepared films possess polycrystalline in nature. Microstructural parameters such as crystallite size, strain and dislocation density are evaluated using observed X-ray diffraction data. Optical absorption analysis showed that the prepared films are found to exhibit band gap value around 2.03 eV.

Keywords: 

Copper Telluride, Cyclic voltammetry, SnO2, Optical absorption analysis

1. Introduction
2. Experimental Detams
3. Results and Discussion
4. Conclusions
5. Acknowledgemtent

The corresponding author Dr. S.Thanikaikarasan (Principal Investigator) gr atefully acknowledge the financial suppor t r eceived from the Board of Research in Nuclear Sciences -Department of Atomic Energy (BRNS-DAE), BARC, Mumbai, India with File No.2012/34/13/BRNS/No.166 for car r ying out this research work. The authors acknowledge CONACYT, Mexico for the financial support through the project 236978.

  References

[1] W.S. Chen, J.M. Stewart, R.A. Mickelsen, Appl. Phys. Lett., 46, 1095 (1985).

[2] C. Nascu, I. Pop, V. Ionscu, E. Indra , I. Bratu, Mater. Lett., 32, 73 (1997).

[3] H. Okimura, T. Matsumae, R. Makabe, Thin Solid Films, 71, 53 (1980).

[4] M.A. Korzhuev, Phys. Solid State, 40, 217 (1998).

[5] H.M. Pathan, C.D. Lokhande, D.P. Amalnerkar, T. Seth, Appl. Surf. Sci., 218, 290 (2003).

[6] K. Neyvasagam, N. Soundararajan, V. Venkatraman, V. Ganesan, Vacuum, 82, 72 (2008).

[7] N. Vouroutzis, N. Frangis, C. Manolikas, Phys. Stat. Sol(a), 202, 271 (2005).

[8] A.L. Dawar, A. Kumar, P. Kumar and P.C. Mathur, J. Less-Common Met., 91, 83 (1983).

[9] G.P. Sorokin, Yu. M. Papshev and P.T. Oush, Sov. Phys. Solid State, 7, 181 (1966).

[10] B.S. Farag and S.A. Khodier, Thin Solid Films, 201, 231 (1991).

[11] K Sridhar, K. Chattopadhyay, J. Alloys Compd., 264, 293 (1998).

[12] K. Neyvasagam, N. Soundararajan, Ajaysoni, G.S. Okram and V. Ganesan, phys. stat. sol.(b), 245, 77 (2008).

[13] Dino Ferizović, Martin Muñoz, Thin Solid Films, 519, 6115 (2011).

[14] F.de Moure-Flores, J.G. Quiñones-Galván, A. Guillén-Cervantes, A. Hernández-Hernández, M. de la L. Olvera, J. Santoyo-Salazar, G. Contreras-Puente, M. Zapata-Torres, M. Meléndez-Lira, Surf. Coat. Tech., 217, 181 (2013).

[15] Han Joon Kwon, S. Thanikaikarasan, Thaiyan Mahalingam, Kyung Ho Park, C. Sanjeeviraja, Yong Deak Kim, J. J Mater. Sci. Mater. Electron., 19, 1086 (2008).

[16] C. Wang, W.Y. Zhang, X.F. Qian, X. M. Zhang, Y. Xie, Y.T. Qian, Mater. Chem. Phys., 60, 99 (1999).

[17] S. Thanikaikarasan, T. Mahalingam, M. Raja, S. Velumani, Mater. Sci. Semicond. Process, 37, 215 (2015).

[18] B. Bharathi, S. Thanikaikarasan, Pratap Kollu, P.V. Chandra-sekar, K. Sankaranarayanan, X. Sahaya Shajan, J. Mater. Sci. Mater. Electron, 25, 5338 (2014).

[19] Sethuramachandran Thanikaikarasan, Chinnapyan Vedhi, Xa-vier Sahaya Shajan, Thaiyan Mahalingam, Solid State Sciences, (2013).

[20] S. Thanikaikarasan, T. Mahalingam, K. Sundaram, A. Kathalingam, Yong Deak Kim, Taekyu Kim, Vacuum, 83,1066 (2009).

[21] S. Thanikaikarasan, T. Mahalingam, V. Dhanasekaran, A. Kathalingam, Jin Koo Rhee, J. Materials Science Mater Elec-tron, 23, 1561 (2012).

[22] File No.39 1061, (Joined Council for Powder Diffracted Sys-tems International Centre for Diffraction Data, Pennsylvenia, USA, 2003.

[23] S. Thanikaikarasan, X. Sahaya Shajan, V. Dhanasekaran, T. Mahalingam, J. Mater. Sci. 46, 4034 (2011).